Wafer to wafer LED test & scanning back end semiconductor handler

LED WtW platform (world LED fastest wafer rebuilt platform with unique foil to foil process) LED handling, for category sorting and binning, has become a standard process for regular non-fragile LED packages. However, with the constant evolution of this market, new fragile components with ceramic packages, silicon lenses or exotic shape, can not use a regular bulk handling process anymore. Ismeca Semiconductor brought this year a unique foil to foil handling solution for this type of devices. The equipment accommodates an automatic quality vision inspection and singulated unit opto-electrical test processes from an origin foil wafer (up to 12"), to rebuilt a mapped output foil wafer (up to 8"). The output foil is automatically bar code and data matrix printed on the machine to be traceable with its mapping and avoid any operator mishandling. This entire process occurs at the speed of 18\´000 UPH with 0 ppm package damages. The so-called NX WtW, THE world unique LED foil to foil test & scan platform.