DocumentCode :
2899190
Title :
Decreasing SoC Test Power Dissipation and Test Data Volume Based on Pattern Recombination
Author :
Mei, Chunlei ; Yi, Maoxiang ; Shen, Zhifei
Author_Institution :
Sch. of Electron. Sci. & Appl. Phys., Hefei Univ. of Technol., Hefei, China
fYear :
2011
fDate :
16-18 Nov. 2011
Firstpage :
701
Lastpage :
705
Abstract :
Ever-growing test data volume and test power dissipation poses significant cost and security challenges in testing core-based system-on-chip (SoC). In this paper, a test pattern recombination technique is proposed to improve test data compression and decrease scan test power dissipation. The proposed technique first analyzes the entropy of a test set, which is used to determine the maximum compression ratio, and then divides the test set into a group of patterns that are used as scan slices for scan test based on multi-scan chains. The probability of the compatibility between the patterns in every vector is calculated, according to which the patterns of each test vector are recombined so that the patterns with high compatible probability are placed closely. Finally, for all the test vectors in a test set, a unified arrangement order for their patterns is determined based on the goal that the test set can be compressed and the scan test power dissipation can be decreased to advantage. The proposed scheme is applied to ISCAS89 test benchmarks and their MinTest test sets are used. The experimental results show that compared to the recently presented scheme, the proposed technique can effectively ensure a high data compression ratio and reduce shift power dissipation during testing.
Keywords :
circuit testing; probability; system-on-chip; vectors; ISCAS89 test benchmark; MinTest test set; SoC test power dissipation; core-based SoC testing; core-based system-on-chip testing; data compression ratio; data compression testing; maximum compression ratio; multiscan chain; test data volume; test pattern recombination technique; test set entropy; test vector calculation; Encoding; Entropy; Integrated circuits; Power dissipation; Test data compression; Testing; Vectors; low power dissipation; pattern; recombination; scan slice; test data compression;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Trust, Security and Privacy in Computing and Communications (TrustCom), 2011 IEEE 10th International Conference on
Conference_Location :
Changsha
Print_ISBN :
978-1-4577-2135-9
Type :
conf
DOI :
10.1109/TrustCom.2011.90
Filename :
6120883
Link To Document :
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