• DocumentCode
    2899233
  • Title

    Apply to the package substrate of low low-CTE polyimide laminate sheet

  • Author

    Tsuchiya, Toshiyuki ; Yoshida, Takefumi ; Tsutsumi, Masayuki ; Maeda, Satoshi ; Tsukada, Yutaka

  • Author_Institution
    TOYOBO Co., Ltd., Japan
  • fYear
    2010
  • fDate
    Nov. 30 2010-Dec. 2 2010
  • Firstpage
    1
  • Lastpage
    27
  • Abstract
    A collection of slides from the author´s presentation is discussed. The topics include ultra low-CTE polyimide laminate sheet and its reliability test.
  • Keywords
    laminates; sheet materials; thermal expansion; coefficient of thermal expansion; low-CTE polyimide laminate sheet; reliability test; Heating; Laminates; Polyimides; Reliability; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
  • Conference_Location
    Melaka
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-8825-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2010.5746736
  • Filename
    5746736
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2899233