Title :
Apply to the package substrate of low low-CTE polyimide laminate sheet
Author :
Tsuchiya, Toshiyuki ; Yoshida, Takefumi ; Tsutsumi, Masayuki ; Maeda, Satoshi ; Tsukada, Yutaka
Author_Institution :
TOYOBO Co., Ltd., Japan
fDate :
Nov. 30 2010-Dec. 2 2010
Abstract :
A collection of slides from the author´s presentation is discussed. The topics include ultra low-CTE polyimide laminate sheet and its reliability test.
Keywords :
laminates; sheet materials; thermal expansion; coefficient of thermal expansion; low-CTE polyimide laminate sheet; reliability test; Heating; Laminates; Polyimides; Reliability; Silicon; Substrates;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-8825-4
DOI :
10.1109/IEMT.2010.5746736
