Title :
Leaded module - steering the next industry trend for best in class thermal performance and ease of use
Author :
Yee, Woo Kuan ; Meng, Lee Han ; Lee, Eugene
Author_Institution :
Nat. Semicond. (M), Batu Berendam, Malaysia
fDate :
Nov. 30 2010-Dec. 2 2010
Abstract :
Leveraging semiconductor industry trend today, there is a massive growing demand for module package at end customers´ application. This is essentially due to benefits from system in package as a complete solution for ease of use, miniaturization, enhanced thermal, EMI shielding and low cost IC packaging.
Keywords :
electromagnetic interference; electromagnetic shielding; integrated circuit packaging; semiconductor device packaging; EMI shielding; leaded module package; low cost IC packaging; miniaturization; semiconductor industry trend; thermal performance; Copper; Electronic packaging thermal management; Heat transfer; Heating; Lead; Substrates;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-8825-4
DOI :
10.1109/IEMT.2010.5746738
