• DocumentCode
    2899593
  • Title

    Cu wire neck fatigue fracturing elimination

  • Author

    Xiaoqing, Song ; Haili, Wei ; Hongbin, Zhao

  • Author_Institution
    Leshan Phoenix Semicond. Co. Ltd., Leshan, China
  • fYear
    2010
  • fDate
    Nov. 30 2010-Dec. 2 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper present the challenges of elimination on Cu wire neck fatigue fracturing issue after TC (Temperature Cycle) and IOL (Intermittent Operational Life Test). The qualification lots were detected fracturing after TC1000 cycles and IOL15000 cycles due to stress inner of package; after detail analyze the cross section samples, there is no any abnormal was found from fresh unit; but the minor cracks were detected along the grain edge of Cu crystalloid from TC/IOL units. A big challenge is to search out the key factors which are for fatigue fracturing. As presented in this paper, the Wire Looping Length, Looping Type, Loop Reversion Data, Free Air Ball Size, Wire Type, Wire Grain Size, Capillary Tip Angle, Compound Moisture, Curve Time and TC Profile were considered, DOE result indicate Tg & CTE of compound, package type and TC profile is Key factors for fracturing.
  • Keywords
    copper; fatigue testing; life testing; wires; Cu wire neck fatigue fracturing elimination; TC profile; TC/IOL units; capillary tip angle; compound moisture; crystalloid; curve time; free air ball size; intermittent operational life test; loop reversion data; looping type; temperature cycle; wire grain size; wire looping length; wire type; Bonding; Compounds; Copper; Fatigue; Gold; Lead; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
  • Conference_Location
    Melaka
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-8825-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2010.5746752
  • Filename
    5746752