DocumentCode :
2899593
Title :
Cu wire neck fatigue fracturing elimination
Author :
Xiaoqing, Song ; Haili, Wei ; Hongbin, Zhao
Author_Institution :
Leshan Phoenix Semicond. Co. Ltd., Leshan, China
fYear :
2010
fDate :
Nov. 30 2010-Dec. 2 2010
Firstpage :
1
Lastpage :
4
Abstract :
This paper present the challenges of elimination on Cu wire neck fatigue fracturing issue after TC (Temperature Cycle) and IOL (Intermittent Operational Life Test). The qualification lots were detected fracturing after TC1000 cycles and IOL15000 cycles due to stress inner of package; after detail analyze the cross section samples, there is no any abnormal was found from fresh unit; but the minor cracks were detected along the grain edge of Cu crystalloid from TC/IOL units. A big challenge is to search out the key factors which are for fatigue fracturing. As presented in this paper, the Wire Looping Length, Looping Type, Loop Reversion Data, Free Air Ball Size, Wire Type, Wire Grain Size, Capillary Tip Angle, Compound Moisture, Curve Time and TC Profile were considered, DOE result indicate Tg & CTE of compound, package type and TC profile is Key factors for fracturing.
Keywords :
copper; fatigue testing; life testing; wires; Cu wire neck fatigue fracturing elimination; TC profile; TC/IOL units; capillary tip angle; compound moisture; crystalloid; curve time; free air ball size; intermittent operational life test; loop reversion data; looping type; temperature cycle; wire grain size; wire looping length; wire type; Bonding; Compounds; Copper; Fatigue; Gold; Lead; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location :
Melaka
ISSN :
1089-8190
Print_ISBN :
978-1-4244-8825-4
Type :
conf
DOI :
10.1109/IEMT.2010.5746752
Filename :
5746752
Link To Document :
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