DocumentCode
2899593
Title
Cu wire neck fatigue fracturing elimination
Author
Xiaoqing, Song ; Haili, Wei ; Hongbin, Zhao
Author_Institution
Leshan Phoenix Semicond. Co. Ltd., Leshan, China
fYear
2010
fDate
Nov. 30 2010-Dec. 2 2010
Firstpage
1
Lastpage
4
Abstract
This paper present the challenges of elimination on Cu wire neck fatigue fracturing issue after TC (Temperature Cycle) and IOL (Intermittent Operational Life Test). The qualification lots were detected fracturing after TC1000 cycles and IOL15000 cycles due to stress inner of package; after detail analyze the cross section samples, there is no any abnormal was found from fresh unit; but the minor cracks were detected along the grain edge of Cu crystalloid from TC/IOL units. A big challenge is to search out the key factors which are for fatigue fracturing. As presented in this paper, the Wire Looping Length, Looping Type, Loop Reversion Data, Free Air Ball Size, Wire Type, Wire Grain Size, Capillary Tip Angle, Compound Moisture, Curve Time and TC Profile were considered, DOE result indicate Tg & CTE of compound, package type and TC profile is Key factors for fracturing.
Keywords
copper; fatigue testing; life testing; wires; Cu wire neck fatigue fracturing elimination; TC profile; TC/IOL units; capillary tip angle; compound moisture; crystalloid; curve time; free air ball size; intermittent operational life test; loop reversion data; looping type; temperature cycle; wire grain size; wire looping length; wire type; Bonding; Compounds; Copper; Fatigue; Gold; Lead; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location
Melaka
ISSN
1089-8190
Print_ISBN
978-1-4244-8825-4
Type
conf
DOI
10.1109/IEMT.2010.5746752
Filename
5746752
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