DocumentCode
2899601
Title
High-speed processing of transparent materials with ultrafast lasers
Author
Oshemkov, Sergey ; Dmitriev, Vladimir ; Ben-Zvi, Guy ; Zair, E.
Author_Institution
Inst. of Phys., St. Petersburg State Univ., Russia
fYear
2005
fDate
12-17 June 2005
Firstpage
391
Abstract
High-speed technology for 3D processing of transparent dielectrics based on bulk optical breakdown with ultrafast lasers is developed. Optical glass BK7 and fused silica were used for the patterning 3D structures of predetermined shape inside volume of the sample without affecting on its surface. 3D structures consist of an array of damaged spots in the volume of transparent sample, produced as a result of laser-induced breakdown at the local point of the objective and arranged in accordance with predetermined shape.
Keywords
dielectric materials; laser beam effects; laser materials processing; optical glass; silicon compounds; 3D structure patterning; SiO2; bulk optical breakdown; damage zone arrays; fused silica; high-speed ultrafast laser technology; laser-induced breakdown; optical glass BK7; transparent dielectric material processing; Dielectric breakdown; Dielectric materials; Glass; High speed optical techniques; Optical arrays; Optical materials; Shape; Silicon compounds; Surface emitting lasers; Ultrafast optics;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Europe, 2005. CLEO/Europe. 2005 Conference on
Print_ISBN
0-7803-8974-3
Type
conf
DOI
10.1109/CLEOE.2005.1568170
Filename
1568170
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