• DocumentCode
    2899607
  • Title

    Miniaturization innovation evolution of electronics packaging - What´s coming next …?

  • Author

    Wagiman, Amir Nur Rashid

  • Author_Institution
    Materials Technology Development, Intel Technologies, MALAYSIA
  • fYear
    2010
  • fDate
    Nov. 30 2010-Dec. 2 2010
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Intel´s Moore´s Law focuses on shrinking the transistors in the silicon to be able to pack more and more transistors for a given area. In general, Intel has been able to double the transistor count every 18–24 months and has been doing so while keeping the silicon size at about the same size or even smaller. The key implication to that trend has been the I/O density that needs to be routed through the packaging is also increasing (ie. More I/O count per area).
  • Keywords
    Arrays; Electronics packaging; Flip chip; Packaging; Silicon; System-on-a-chip; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
  • Conference_Location
    Melaka, Malaysia
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-8825-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2010.5746753
  • Filename
    5746753