• DocumentCode
    2899785
  • Title

    Microfabrication of W band folded waveguide slow wave structure using two-step UV-LIGA technology

  • Author

    Li, Hanyan ; Feng, Jinjun

  • Author_Institution
    Nat. Key Lab. of Sci. & Technol. on Vacuum Electron., Beijing Vacuum Electron. Res. Inst., Beijing, China
  • fYear
    2012
  • fDate
    24-26 April 2012
  • Firstpage
    387
  • Lastpage
    388
  • Abstract
    In this paper, We fabricate copper W-Band folded waveguide circuit with the beam tunnel by the optimized process based on two-step UV-LIGA using SU-8 negative photoresist followed by copper electroforming, and the experiment for the bonding of the two halves has been carried out.
  • Keywords
    LIGA; copper; microfabrication; photoresists; waveguides; SU-8 negative photoresist; W band folded waveguide slow wave structure; beam tunnel; copper W-band folded waveguide circuit; copper electroforming; microfabrication; two-step UV-LIGA technology; Bonding; Copper; Etching; Laboratories; Plasma temperature; Resists; Vacuum technology; Microfabrication; SU8; TWT; Terahertz; UV-LIGA; d; folded waveguide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference (IVEC), 2012 IEEE Thirteenth International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4673-0188-6
  • Electronic_ISBN
    978-1-4673-0187-9
  • Type

    conf

  • DOI
    10.1109/IVEC.2012.6262205
  • Filename
    6262205