Packaging trends in mobile electronics - Towards wafer level packaging

Mobile electronics growth has recently been supported by the integration of more features for higher end devices. Smart phones are indeed growing at much faster pace than the overall mobile phone market. Requirements towards packaging are therefore asking breakthrough innovation to allow best package integration at optimized cost. Recent progresses in 3D eWLB packaging and integration will be addressed in this paper as well as vision and future technology requirements in 3D packaging. The advantage of 3D eWLB technology and applications of 3D packaging will be presented with severalexamples. Some discussion around 3D eWLB fabrication process flow, assembly and packaging challenges, and performance characteristics will be also discussed.