DocumentCode
2899883
Title
Multibeam cathode for electron devices
Author
Djubua, B.C. ; Polivnikova, O.V.
Author_Institution
SRPC Istok, Moscow, Russia
fYear
2004
fDate
6-10 Sept. 2004
Firstpage
135
Lastpage
137
Abstract
The principal problem which arises at construction of multibeam cathodes units is provision of small spread in emission parameters of separate emitters in the unit preserving the mechanical strength and the shape stability of the cathode unit. The problem is reduced to the task of effective attachment of emitters to their seats in the cartridge-holder of the unit. There exist some structures of multibeam cathode units in which the emitters are fixed in the cartridge-holder by means of rolling or welding. A disadvantage of such units is their insufficient mechanical strength and a large scatter of temperature between separate emitters particularly under thermomechanical loads. As a rule, the emitters are made of tungsten sponge impregnated with barium-calcium aluminate. A cure for these difficulties is soldering. In this connection, the emitters are inserted into the holes in the cartridge-holder and in this case, there is a clearance of a definite width are made between the emitter and the walls of the hole, while the solder is located both inside the clearance and on the side of the emitter, opposite to the emitting surface, the emitter being immersed in the hole of the cartridge-holder down to some definite depth.
Keywords
cathodes; electron device manufacture; electron emission; soldering; Ba; Ca; W; barium-calcium aluminate; cartridge-holder; cathode unit; electron devices; emission parameters; mechanical strength; multibeam cathode; shape stability; soldering; thermomechanical loads; tungsten sponge; Cathodes; Electron devices; Scattering; Shape; Soldering; Stability; Temperature; Thermomechanical processes; Tungsten; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electron Sources Conference, 2004. Proceedings. IVESC 2004. The 5th International
Print_ISBN
0-7803-8437-7
Type
conf
DOI
10.1109/IVESC.2004.1414164
Filename
1414164
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