DocumentCode
2901034
Title
BiCMOS ASICs: technology and applications
Author
Wong, Thomas
Author_Institution
Semicond. & I.C. Div., Hitachi America Ltd., Brisbane, CA, USA
fYear
1990
fDate
17-21 Sep 1990
Abstract
It is pointed out that although higher speed and lower power dissipation allow BiCMOS to compete with CMOS and ECL devices, CMOS continues to be the choice for large density, low-power, and cost-sensitive application, and ECL remains the preferred choice for very-high-speed medium-density applications. The latter include cache static RAM, telecom, and interface chips between CMOS and fast ECL and TTL memory. BiCMOS now offers system designers an important bridge between power-hungry ECL and high-density CMOS. BiCMOS SRAMs are the most well-known type of high-performance BiCMOS devices. In addition to SRAMS, BiCMOS DRAMs have also been introduced. BiCMOS gate arrays find widespread acceptance in applications such as high-end personal computers, laser printers, workstations, mini-supers, and telecommunications. A relatively new application for BiCMOS technology is in the area of RISC CPUs
Keywords
BIMOS integrated circuits; DRAM chips; SRAM chips; application specific integrated circuits; integrated circuit technology; logic arrays; BiCMOS ASICs; DRAMs; SRAMs; gate arrays; logic circuits; memory circuits; monolithic IC; Application software; BiCMOS integrated circuits; Bridges; CMOS technology; Microcomputers; Optical arrays; Power dissipation; Random access memory; Read-write memory; Telecommunications;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
Conference_Location
Rochester, NY
Type
conf
DOI
10.1109/ASIC.1990.186081
Filename
186081
Link To Document