• DocumentCode
    2901034
  • Title

    BiCMOS ASICs: technology and applications

  • Author

    Wong, Thomas

  • Author_Institution
    Semicond. & I.C. Div., Hitachi America Ltd., Brisbane, CA, USA
  • fYear
    1990
  • fDate
    17-21 Sep 1990
  • Abstract
    It is pointed out that although higher speed and lower power dissipation allow BiCMOS to compete with CMOS and ECL devices, CMOS continues to be the choice for large density, low-power, and cost-sensitive application, and ECL remains the preferred choice for very-high-speed medium-density applications. The latter include cache static RAM, telecom, and interface chips between CMOS and fast ECL and TTL memory. BiCMOS now offers system designers an important bridge between power-hungry ECL and high-density CMOS. BiCMOS SRAMs are the most well-known type of high-performance BiCMOS devices. In addition to SRAMS, BiCMOS DRAMs have also been introduced. BiCMOS gate arrays find widespread acceptance in applications such as high-end personal computers, laser printers, workstations, mini-supers, and telecommunications. A relatively new application for BiCMOS technology is in the area of RISC CPUs
  • Keywords
    BIMOS integrated circuits; DRAM chips; SRAM chips; application specific integrated circuits; integrated circuit technology; logic arrays; BiCMOS ASICs; DRAMs; SRAMs; gate arrays; logic circuits; memory circuits; monolithic IC; Application software; BiCMOS integrated circuits; Bridges; CMOS technology; Microcomputers; Optical arrays; Power dissipation; Random access memory; Read-write memory; Telecommunications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
  • Conference_Location
    Rochester, NY
  • Type

    conf

  • DOI
    10.1109/ASIC.1990.186081
  • Filename
    186081