DocumentCode
2901043
Title
The realities of ASIC packaging
Author
Wong, Thomas
Author_Institution
Semicond. & I.C. Div., Hitachi America Ltd., Brisbane, CA, USA
fYear
1990
fDate
17-21 Sep 1990
Abstract
Summary form only given, as follows. ASIC is the technology driver for advanced packaging. This includes high-pin-count surface mount devices, high-performance ceramic packages, tape automated bonding (TAB) packages, and multichip modules (MCM). Emphasis is placed on fine-pitch technology (FPT) and the advantages and limitations of quad flat packs (QFP). Limitations due to power dissipation, ability to handle large die sizes, pin pitch below 0.4 mm, and coplanarity issues are addressed. Future trends in ASIC packaging are covered. A short introduction to multichip modules is also presented
Keywords
application specific integrated circuits; integrated circuit technology; packaging; 0.4 mm; ASIC packaging; TAB; ceramic packages; coplanarity issues; fine-pitch technology; high-pin-count; multichip modules; power dissipation; quad flat packs; surface mount devices; tape automated bonding; Application specific integrated circuits; Ceramics; Electronics packaging; Plastic packaging; Power dissipation; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
Conference_Location
Rochester, NY
Type
conf
DOI
10.1109/ASIC.1990.186082
Filename
186082
Link To Document