Title :
The realities of ASIC packaging
Author_Institution :
Semicond. & I.C. Div., Hitachi America Ltd., Brisbane, CA, USA
Abstract :
Summary form only given, as follows. ASIC is the technology driver for advanced packaging. This includes high-pin-count surface mount devices, high-performance ceramic packages, tape automated bonding (TAB) packages, and multichip modules (MCM). Emphasis is placed on fine-pitch technology (FPT) and the advantages and limitations of quad flat packs (QFP). Limitations due to power dissipation, ability to handle large die sizes, pin pitch below 0.4 mm, and coplanarity issues are addressed. Future trends in ASIC packaging are covered. A short introduction to multichip modules is also presented
Keywords :
application specific integrated circuits; integrated circuit technology; packaging; 0.4 mm; ASIC packaging; TAB; ceramic packages; coplanarity issues; fine-pitch technology; high-pin-count; multichip modules; power dissipation; quad flat packs; surface mount devices; tape automated bonding; Application specific integrated circuits; Ceramics; Electronics packaging; Plastic packaging; Power dissipation; Semiconductor device packaging;
Conference_Titel :
ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
Conference_Location :
Rochester, NY
DOI :
10.1109/ASIC.1990.186082
