• DocumentCode
    2901088
  • Title

    Device reliability study of GaN HEMTs using both low frequency noise and microwave noise temperature spectroscopy

  • Author

    Rao, Hemant ; Bosman, Gijs

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
  • fYear
    2011
  • fDate
    12-16 June 2011
  • Firstpage
    464
  • Lastpage
    467
  • Abstract
    Microwave noise temperature spectroscopy is performed on gated AlGaN/GaN high electron mobility transistors as a function of gate and drain bias. The results are combined with low frequency noise (LFN) spectroscopy to understand device degradation and specific mechanisms responsible for it. It was found that channel noise temperature shows a strong dependence to channel voltage. On the other hand self-heating related power dissipation is weakly correlated to the measured noise temperature. This indicates that microwave noise temperature can act as a useful reliability characterization tool.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; microwave spectra; semiconductor device noise; semiconductor device reliability; wide band gap semiconductors; AlGaN-GaN; HEMT; LFN spectroscopy; channel voltage; drain bias; gate bias; high electron mobility transistor; low frequency noise temperature spectroscopy; microwave noise temperature spectroscopy; noise temperature measurement; power dissipation; semiconductor device reliability; Degradation; Gallium nitride; Logic gates; MODFETs; Noise; Noise measurement; Temperature measurement; AlGaN/GaN HEMTs; hot-electron; low frequency noise; microwave noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Noise and Fluctuations (ICNF), 2011 21st International Conference on
  • Conference_Location
    Toronto, ON
  • Print_ISBN
    978-1-4577-0189-4
  • Type

    conf

  • DOI
    10.1109/ICNF.2011.5994370
  • Filename
    5994370