Title :
Wafer Level IC Burn-in As A Step Towards Bir
Author :
Miller, James W. ; Soorholtz, Vince ; Vesquez, B.
Author_Institution :
Motorola
Keywords :
Acceleration; Circuit testing; Costs; Manufacturing; Marketing and sales; Packaging; Production; Reliability engineering; Stress; Wafer scale integration;
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
DOI :
10.1109/IWLR.1992.657999
