DocumentCode
2901205
Title
Quick turn around ASIC size estimation and tradeoff for new designs and technology migration using user driven careabouts
Author
Hu, Gilbert K D
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1990
fDate
17-21 Sep 1990
Abstract
A system that provides quick turnaround for ASIC feasibility evaluation and tradeoff for design, test, and manufacturability is described. During proposal or design phase, users can estimate ASIC size and performance for both new designs and technology migration, as the design architecture, system budget, user careabouts, ASIC technology, packaging, and other alternatives are selected
Keywords
application specific integrated circuits; integrated circuit technology; ASIC technology; design architecture; design tradeoff; feasibility evaluation; manufacturability; packaging; quick turnaround; size estimation; system budget; technology migration; test; Application specific integrated circuits; Design automation; Design engineering; Information analysis; Packaging; Performance evaluation; Phase estimation; Pins; Power dissipation; Proposals;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
Conference_Location
Rochester, NY
Type
conf
DOI
10.1109/ASIC.1990.186090
Filename
186090
Link To Document