Title :
Quick turn around ASIC size estimation and tradeoff for new designs and technology migration using user driven careabouts
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
A system that provides quick turnaround for ASIC feasibility evaluation and tradeoff for design, test, and manufacturability is described. During proposal or design phase, users can estimate ASIC size and performance for both new designs and technology migration, as the design architecture, system budget, user careabouts, ASIC technology, packaging, and other alternatives are selected
Keywords :
application specific integrated circuits; integrated circuit technology; ASIC technology; design architecture; design tradeoff; feasibility evaluation; manufacturability; packaging; quick turnaround; size estimation; system budget; technology migration; test; Application specific integrated circuits; Design automation; Design engineering; Information analysis; Packaging; Performance evaluation; Phase estimation; Pins; Power dissipation; Proposals;
Conference_Titel :
ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
Conference_Location :
Rochester, NY
DOI :
10.1109/ASIC.1990.186090
