DocumentCode

2901345

Title

Thin Film Cracking / Delamination Evaluation Using Assembly Test Chip

Author

Hong, Charles

Author_Institution

Intel Corporation

fYear

1992

fDate

25-28 Oct. 1992

Firstpage

163

Lastpage

166

Keywords

Assembly; Delamination; Failure analysis; Moisture; Packaging; Passivation; Plastic films; Stress; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Level Reliability Workshop, 1992. Final Report., 1992 International

Conference_Location

Lake Tahoe, CA, USA

Type

conf

DOI

10.1109/IWLR.1992.658000

Filename

658000