• DocumentCode
    2901714
  • Title

    TCAD-prototyping with new accurate worst-case definition for a 0.2 micron CMOS-ASIC process

  • Author

    Kunitomo, Hiroyasu ; Sat, Hisako ; Tsuneno, Katsumi ; Ikematsu, R. ; Masuda, Hiroo

  • Author_Institution
    Hitachi ULSI Syst. Ltd., Tokyo, Japan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    38
  • Lastpage
    41
  • Abstract
    An industrial statistical worst case modeling process for 0.2 μm CMOS is presented. It is based on new TCAD-prototyping with efficient correlation analysis for CMOS performance goals under process variability. Since the manufacturing process undergoes ongoing improvement, well-calibrated TCAD is primary tool to construct realistic performance corner models. A robust TCAD calibration method is one of the keys to achieving accurate prediction. Statistically least conservative “worst case” conditions are newly identified, which state that 99.7% of device performance is contained between the FF (fast fast) and SS (slow slow) worst corners. This reduces the design guardband by 10% compared with conventional worst case approaches
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; calibration; correlation methods; integrated circuit design; integrated circuit modelling; integrated circuit yield; rapid prototyping (industrial); semiconductor process modelling; statistical analysis; technology CAD (electronics); 0.2 micron; CMOS performance goals; CMOS-ASIC process; FF worst corners; SS worst corners; TCAD calibration method; TCAD-prototyping; calibrated TCAD; correlation analysis; design guardband; device performance; fast fast worst corners; industrial statistical worst case modeling process; manufacturing process; performance corner models; process variability; slow slow worst corners; statistically least conservative worst case conditions; worst case approaches; worst-case definition; CMOS process; Calibration; Circuits; Manufacturing processes; Performance analysis; Predictive models; Process design; Prototypes; Scattering; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Statistical Metrology, 1999. IWSM. 1999 4th International Workshop on
  • Conference_Location
    Kyoto
  • Print_ISBN
    0-7803-5154-1
  • Type

    conf

  • DOI
    10.1109/IWSTM.1999.773191
  • Filename
    773191