Title :
The Isothermal Wafer Level Test for VLSl Interconnect Evaluation
Author :
Hijab, Raif S. ; Yue, John T.
Author_Institution :
Advanced Micro Devices
Keywords :
Current density; Electrical resistance measurement; Electromigration; Heating; Isothermal processes; Materials testing; Semiconductor device packaging; System testing; Temperature; Wafer scale integration;
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
DOI :
10.1109/IWLR.1992.658004
