DocumentCode :
2902514
Title :
MEMS-4-MMIC The next step in combined GaAs MEMS-MMIC technology
Author :
Baggen, L. ; Simon, W. ; Malmqvist, R. ; Vähä-Heikkilä, T. ; Maher, H. ; Seok, S.
Author_Institution :
IMST, Kamp-Lintfort, Germany
fYear :
2012
fDate :
25-28 June 2012
Firstpage :
1
Lastpage :
5
Abstract :
this article summarizes the overall progress made during the last 4 project years of the FP7 EU-project MEMS-4-MMIC that focuses on the merging of innovative RF-MEMS (Micro-Electrical-Mechanical-Systems) switch designs with established MMIC-technology. The final goal is to include RF-MEMS switches into a standard commercial foundry process. Such switches can become standard building blocks for MMIC circuits such as transistors, resistors and capacitors and can be used for specific RF-applications such as phased arrays, reconfigurable arrays with switch beam networks, or cognitive systems, for example. The complete value chain for manufacturing is addressed within the project with reliability and 0-level packaging as key issues for manufacturing.
Keywords :
MMIC; foundries; gallium arsenide; microswitches; semiconductor device manufacture; semiconductor device packaging; semiconductor device reliability; 0-level packaging; FP7 EU-project MEMS-4-MMIC; GaAs; MMIC-technology; capacitors; cognitive systems; complete value chain; innovative RF-MEMS switch designs; microelectrical-mechanical-systems; phased arrays; reconfigurable arrays; resistors; standard commercial foundry process; switch beam networks; transistors; Loss measurement; MMICs; Micromechanical devices; Packaging; Reliability; Switches; Switching circuits; GaAs; LNA; MEMS; MMIC; SPDT; SPST; agile systems; foundry; packaging; phased array; radar; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antenna Technology and Applied Electromagnetics (ANTEM), 2012 15th International Symposium on
Conference_Location :
Toulouse
Print_ISBN :
978-1-4673-0290-6
Type :
conf
DOI :
10.1109/ANTEM.2012.6262342
Filename :
6262342
Link To Document :
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