DocumentCode
2902641
Title
[Copyright notice]
fYear
2007
fDate
14-17 Aug. 2007
Abstract
The following topics are dealt with: advanced packaging and system packaging; high density substrate and SMT; packaging design and modeling; packaging materials and processes; advanced manufacturing technology; quality and reliability.
Keywords
manufacturing processes; packaging; quality control; reliability; semiconductor process modelling; substrates; surface mount technology; SMT; advanced manufacturing technology; advanced packaging; high density substrate; packaging design; packaging materials; packaging modeling; packaging processes; quality; reliability; system packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1391-1
Type
conf
DOI
10.1109/ICEPT.2007.4441372
Filename
4441372
Link To Document