Title :
Re-targetting manufacturing technologies in multichip module layout
Author_Institution :
Valid Logic Syst., Chelmsford, MA, USA
Abstract :
The author describes how a multichip module (MCM) may be retargeted from one manufacturing technology to another during the physical layout. Some of the differences in manufacturing techniques of the MCM-C, MCM-L, and MCM-D and the effects that they have on the layout task are discussed. MCM-L uses a laminated circuit board process, MCM-C is a cofired ceramic process, and MCM-D is similar to an IC manufacturing process in which conductive material is deposited on to a silicon substrate. The system consists of both design and analysis tools. Automatic routing up to 48 signal layers and electrical analysis for reflections, crosstalk, and simple thermal analysis are described
Keywords :
circuit layout; crosstalk; hybrid integrated circuits; integrated circuit manufacture; MCM-C; MCM-D; MCM-L; Si; cofired ceramic process; conductive material; crosstalk; electrical analysis; laminated circuit board process; manufacturing technology; multichip module layout; physical layout; signal layers; thermal analysis; Ceramics; Conducting materials; Crosstalk; Manufacturing processes; Multichip modules; Printed circuits; Reflection; Routing; Signal analysis; Silicon;
Conference_Titel :
ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
Conference_Location :
Rochester, NY
DOI :
10.1109/ASIC.1990.186199
