Re-targetting manufacturing technologies in multichip module layout

Author

Tasker, Shiv

Author_Institution

Valid Logic Syst., Chelmsford, MA, USA

fYear

1990

fDate

17-21 Sep 1990

Abstract

The author describes how a multichip module (MCM) may be retargeted from one manufacturing technology to another during the physical layout. Some of the differences in manufacturing techniques of the MCM-C, MCM-L, and MCM-D and the effects that they have on the layout task are discussed. MCM-L uses a laminated circuit board process, MCM-C is a cofired ceramic process, and MCM-D is similar to an IC manufacturing process in which conductive material is deposited on to a silicon substrate. The system consists of both design and analysis tools. Automatic routing up to 48 signal layers and electrical analysis for reflections, crosstalk, and simple thermal analysis are described

Keywords

circuit layout; crosstalk; hybrid integrated circuits; integrated circuit manufacture; MCM-C; MCM-D; MCM-L; Si; cofired ceramic process; conductive material; crosstalk; electrical analysis; laminated circuit board process; manufacturing technology; multichip module layout; physical layout; signal layers; thermal analysis; Ceramics; Conducting materials; Crosstalk; Manufacturing processes; Multichip modules; Printed circuits; Reflection; Routing; Signal analysis; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE

Conference_Location

Rochester, NY

Type

conf

DOI

10.1109/ASIC.1990.186199

Filename

186199