Title :
The Effect of Cavities and Channels on the Strength of LTCC Substrate
Author :
Zhang, Yang-Fei ; Miao, Min ; Bai, Shu-Lin ; Jin, Yu-Feng
Author_Institution :
Peking Univ., Beijing
Abstract :
The effect of cavities and channels on the strength of LTCC substrate has been investigated by finite element analysis with commercial software ANSYS. The simulation model is based on three-point bending test of thick film LTCC substrate. Axial tensile stress and shear stress among layers are characterized to describe the effect on flexural strength and inter-layer shear strength. X, Y-axial channels, Z-axial via-hole, and cavities of various amounts are formed in the middle or surface layers of the LTCC substrate. The simulation results show that the maximum tensile stress always appears on the midline of the substrate bottom and causes fracture. The shear stress concentration has been found on the sidewalls of the holes and cavities and enhances the interlayer stripping.
Keywords :
bending strength; ceramics; electronics packaging; finite element analysis; firing (materials); fracture; shear strength; stress analysis; tensile testing; thick films; axial tensile stress; cavities effect; channel effect; commercial ANSYS software; finite element analysis; flexural strength; fracture; inter-layer shear strength; interlayer stripping enhancement; low-temperature co-fired ceramic substrate; shear stress; shear stress concentration; thick film LTCC substrate strength; three-point bending test; Composite materials; Conducting materials; Fabrication; Finite element methods; Packaging; Substrates; Temperature; Tensile stress; Testing; Thick films;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441383
