New Sensor Packaging Concept for Avionic Application

Author

Aschenbrenner, R. ; Jung, E. ; Braun, T. ; Oestermann, U. ; Bauer, J. ; Becker, K.-F. ; Reichl, H.

Author_Institution

Fraunhofer Inst. for Reliability & Microintegration, Berlin

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

4

Abstract

A new packaging technology for a micro-electro-mechanical system (MEMS) pressure sensor was developed to allow the integration of the sensor in a probe mounted on the outside of the airplane. Thus this packaging concept will increase the reliability of equipment by avoiding extra pneumatic connections. Intrinsic advantages of this approach are the avoidance of pressure leaks and the elimination of bad pneumatic connection risk during installation or maintenance phases.

Keywords

aerospace safety; aircraft maintenance; avionics; electronics packaging; microsensors; pressure sensors; reliability; avionic application; equipment reliability; installation phase; maintenance phase; microelectro-mechanical system pressure sensor packaging; pneumatic connection risk elimination; pressure leakage avoidance; Aerospace electronics; Assembly; Biomembranes; Ducts; Packaging machines; Probes; Sensor systems; Space technology; Spirals; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441384

Filename

4441384