Title :
The Components Layout Optimization of Circuit Module Based on the Artificial Nerve Network
Author :
Huang, Hong-yan ; Zhou, De-jian ; Wu, Zhao-hua
Author_Institution :
Xidian Univ., Xi´´an
Abstract :
In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.
Keywords :
circuit CAD; circuit optimisation; finite element analysis; neural nets; printed circuit layout; temperature distribution; thermal analysis; FEM; PCB design; artificial nerve network; circuit module; components layout optimization; computer aided thermal simulation; finite element method; heat diffusion; heat generation; printed circuit board design; temperature distribution; temperature field analysis; thermal design method; Analytical models; Circuit simulation; Computational modeling; Computer simulation; Concrete; Design methodology; Finite element methods; Optimization methods; Temperature distribution; Thermal factors;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441388
