The Components Layout Optimization of Circuit Module Based on the Artificial Nerve Network

Author

Huang, Hong-yan ; Zhou, De-jian ; Wu, Zhao-hua

Author_Institution

Xidian Univ., Xi´´an

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

2

Abstract

In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.

Keywords

circuit CAD; circuit optimisation; finite element analysis; neural nets; printed circuit layout; temperature distribution; thermal analysis; FEM; PCB design; artificial nerve network; circuit module; components layout optimization; computer aided thermal simulation; finite element method; heat diffusion; heat generation; printed circuit board design; temperature distribution; temperature field analysis; thermal design method; Analytical models; Circuit simulation; Computational modeling; Computer simulation; Concrete; Design methodology; Finite element methods; Optimization methods; Temperature distribution; Thermal factors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441388

Filename

4441388