Multilayer Hybrid Circuit Technology

Author

Flick, Stefan ; Luo, Qingsheng ; Klein, Randy

Author_Institution

Heraeus TFD, Hanau

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

6

Abstract

The technology that multilayer hybrid circuits use dielectric layer to insulate stacked conduct has been applied many years, but it is limited by the layers and product yield. This paper introduces a newly dielectric paste of Heraeus, recommend several material systems for multilayer hybrid application. Provide comprehensive data based on experiment in migration stability, laser trimming, adhesion, wire bonding reliability and compatibility. This technology would meet hybrid company demands necessary in multilayer hybrid design, manufacturing process, and product reliability. There is a great benefit for existing thick film technology in both commercial and reliability products application.

Keywords

adhesion; dielectric materials; hybrid integrated circuits; integrated circuit design; integrated circuit technology; lead bonding; multilayers; reliability; adhesion; bonding compatibility; dielectric Heraeus paste; laser trimming; manufacturing process; migration stability experiments; multilayer hybrid circuit technology; multilayer hybrid design; product reliability; thick film technology; wire bonding reliability; Adhesives; Bonding; Circuit stability; Conducting materials; Dielectric materials; Dielectrics and electrical insulation; Laser stability; Nonhomogeneous media; Optical materials; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441389

Filename

4441389