Title :
The Thermal Analysis of QFP Components Geared to the Needs of the Application of Encapsulation Design and Assembly
Author :
Zhou, De-jian ; Huang, Hong-yan ; Peng, Kai--qiang
Author_Institution :
Guilin Univ. of Technol., Guilin
Abstract :
That the QFP components are applied successfully depends on its heat design and analysis. So, in tins paper, facing the application of encapsulation design and assembly, a three dimensional model based on temperature field and its simulation analysis is carried out by using the finite element method under different cooling condition and structure parameters, according to such problems for QFP as cooling design the heat effect of the thickness of encapsulation layer and chip. And, some relevant results are achieved and some corresponding advices for heat design are put forward with practice. These methods and conclusions can provide the QFP designer of structure and techniques of components encapsulation and assembly a lot of references.
Keywords :
encapsulation; finite element analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; thermal analysis; thermal management (packaging); cooling condition; encapsulation assembly; encapsulation design; finite element method; heat design; integrated circuits; quad flat package components; structure parameters; thermal analysis; three dimensional temperature field model; Analytical models; Assembly; Cooling; Electronics packaging; Encapsulation; Finite element methods; Integrated circuit packaging; Pins; Plastics; Temperature; QFP component; finite element method; heat analysis;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441392
