Title :
Summary Report: Package/assembly Discussion Group
Author :
Mohan, Kunal ; Shirley, G. ; Sweet, John
Keywords :
Adhesives; Assembly; Contamination; Lead; Moisture; Packaging; Passivation; Pollution measurement; Stress measurement; Testing;
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
DOI :
10.1109/IWLR.1992.658009
