DocumentCode

2903101

Title

Summary Report: Package/assembly Discussion Group

Author

Mohan, Kunal ; Shirley, G. ; Sweet, John

fYear

1992

fDate

25-28 Oct. 1992

Firstpage

229

Lastpage

230

Keywords

Adhesives; Assembly; Contamination; Lead; Moisture; Packaging; Passivation; Pollution measurement; Stress measurement; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Level Reliability Workshop, 1992. Final Report., 1992 International

Conference_Location

Lake Tahoe, CA, USA

Type

conf

DOI

10.1109/IWLR.1992.658009

Filename

658009