Influence of PCB Vibration Modal on Peeling Stress of Solder Joints in Board-level Package Under Drop Impact

Author

Jie, Bai ; Fei, Qin ; Tong, An ; Chen, Na

Author_Institution

Beijing Univ. of Technol., Beijing

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

1

Abstract

In this paper, a very detailed finite element model of PCB board and BGA package was constructed. A dynamic drop/impact simulation of the board-level package was conducted by LS-DYNA and Input-G approach under the drop Condition H recommended by JEDEC standard JESD22-B111. A PCB deflection equivalent static analysis was conducted also in order to investigate the difference of peeling stress between the dynamic and the static model.

Keywords

ball grid arrays; integrated circuit packaging; integrated circuit reliability; printed circuits; solders; stress analysis; BGA package; Input-G approach; JEDEC standard; JESD22-B111 standard; LS-DYNA; PCB board level packages; PCB deflection equivalent static analysis; PCB vibration modal; drop-impact loadings; drop-impact simulation; oversafe design; packages reliability; solder joints; static peeling stress analysis; Computational modeling; Computer simulation; Electronics packaging; Finite element methods; Mechanical engineering; Numerical simulation; Soldering; Stress; Transient analysis; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441409

Filename

4441409