Title :
The Design of New Ultrasonic Transducers for Wire bonding Devices
Author :
Wu, Yimin ; Chen, Jian ; Zhao, Xingyu ; Wang, Fujun
Author_Institution :
Tianjin Univ., Tianjin
Abstract :
Ultrasonic transducer is an important part of bonding-head in wire bonding device. Bonding quality is effected by ultrasonic transducer properties. According to a dimension plane-wave theory, an initial design of ultrasonic transducer is presented. Ultrasonic transducer modal frequency is calculated by FEM. Prototype is fabricated and tested using impedance analysis instrument. Experimental results indicate that ultrasonic transducer has 128 kHz longitudinal vibration frequency. Ultrasonic transducer vibration properties can satisfied the demand of wire bonding device.
Keywords :
finite element analysis; integrated circuit bonding; lead bonding; ultrasonic bonding; ultrasonic transducers; FEM; bonding quality; dimension plane-wave theory; frequency 128 kHz; impedance analysis instrument; modal frequency; ultrasonic transducers; wire bonding devices; Bonding; Equations; Frequency; Mechanical engineering; Prototypes; Slabs; Testing; Ultrasonic transducers; Vibrations; Wire;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441411
