• DocumentCode
    2903320
  • Title

    Summary Report: Component Design Discussion Group

  • Author

    Tyree, Vance ; Kuo, Clinton

  • Author_Institution
    Information Sciences/USC
  • fYear
    1992
  • fDate
    25-28 Oct. 1992
  • Firstpage
    231
  • Lastpage
    232
  • Keywords
    Degradation; Design automation; Dielectric breakdown; Electromigration; Fabrication; Fault tolerance; Hot carriers; Integrated circuit testing; Manufacturing processes; Process design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Type

    conf

  • DOI
    10.1109/IWLR.1992.658010
  • Filename
    658010
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2903320