Title :
Test/Repair Area Overhead Reduction for Small Embedded SRAMs
Author :
Wang, Baosheng ; Qiang Xu
Author_Institution :
ATI Technol. Inc., Markham, Ont.
Abstract :
For current highly-integrated and memory-dominant system-on-a-chips (SoCs), especially for graphics and networking SoCs, the test/repair area overhead of embedded SRAMs (e-SRAMs) is a big concern. This paper presents various approaches to tackle this problem from a practical point of view. Without sacrificing at-speed testability, diagnosis capability and repairability, the proposed approaches consider partly sharing wrapper for identical memories, sharing memory BIST controllers for e-SRAMs embedded in different functional blocks, test responses compression for wide memories, and various repair strategies for e-SRAMs with different configurations. By combining the above approaches, the test/repair area overhead for e-SRAMs can be significantly reduced. For example, for one benchmark SoC used in our experiments, it can be reduced as much as 10% of the entire memory array
Keywords :
SRAM chips; built-in self test; embedded systems; logic testing; system-on-chip; area overhead; built-in self test; diagnosis capability; embedded SRAM; sharing wrapper; speed testability; system-on-chip; test responses compression; Automatic testing; Benchmark testing; Built-in self-test; Circuit testing; Distributed power generation; Power generation; Routing; System testing; System-on-a-chip; Test pattern generators; Area Overhead; BIST; Embedded Small SRAMs; Single-Element Repair;
Conference_Titel :
Test Symposium, 2006. ATS '06. 15th Asian
Conference_Location :
Fukuoka
Print_ISBN :
0-7695-2628-4
DOI :
10.1109/ATS.2006.260990