Title :
The Study for Thermal Analysis Technology of Three-Dimension SRAM Component
Author :
Cao, Yusheng ; Jiang, Tong ; Liu, Jun ; Lian, Binhao
Author_Institution :
Beijing Microelectronics Technology Institute MXTronics Corporation, Beijing 100076, China. Email: cys0113@sohu.com
Abstract :
The thermal capacity of unit volume is increasing with the development of 3D IC package density. The technology of thermal analysis and thermal design for 3D package becomes more and more important. This paper analyzes the structure and working mode of a particular 3D SRAM component. The thermal distribution is simulated with the Ansys software in which the finite element method is applied. The simulation results can be well compared with the experimental data, which further supports the reliability design of 3D SRAM package technology and the thermal analysis technology.
Keywords :
Analytical models; Electronic packaging thermal management; Electronics packaging; Microelectronics; Occupational stress; Random access memory; SRAM chips; Temperature distribution; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441418
