Electromigration in Lead-Free Sn3.8Ag0.7Cu Solder Reaction Couple

Author

He, Hongwen ; Xu, Guangchen ; Hao, Hu ; Guo, Fu

Author_Institution

Beijing Univ. of Technol., Beijing

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

5

Abstract

Electromigration is one of the severe reliability problems in IC progress. In this paper, the electromigration of eutectic Sn3.8Ag0.7Cu solder reaction couples were studied under high temperature (150degC) and high current density (5times10³ A/cm²) in three days. An original design which could reduce the local Joule heating caused by current crowding was produced. Voltage change was also monitored during this experiment. Hillocks and valleys were found at the anode side and cathode side respectively. Unlike aging test, electromigration could promote the formation of intermetallic compound (IMC) at cathode side and inhibit the formation of IMC at anode side. Cracks also appeared along the cathode side after electromigration in three days, but they were not leading the solder reaction couple to failure.

Keywords

copper alloys; electromigration; integrated circuit reliability; silver alloys; solders; tin alloys; SnAgCu; anode side; cathode side; electromigration; high current density; integrated circuit reliability; intermetallic compound; lead-free solder; local Joule heating; reaction couple; temperature 150 C; Anodes; Cathodes; Current density; Electromigration; Environmentally friendly manufacturing techniques; Heating; Lead; Proximity effect; Temperature; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441425

Filename

4441425