Title :
Thermal compensation of semiconductor strain gauge type pressure transducers using a real-time process
Author_Institution :
R. Aerosp. Establ., Bedford, UK
Abstract :
A method is described in which digital computing techniques are used in conjunction with custom-built hardware to improve the thermal stability of semiconductor strain-gauge-type pressure transducers. The basic design philosophy is discussed. Preliminary laboratory results on a sample of twelve transducers have been very encouraging, providing compensated values (as a temperature coefficient presented as a function of the full-scale pressure range) on the order of ±0.002%FS/°C. On some devices this represents an improvement of approximately two orders of magnitude over the corresponding uncompensated value
Keywords :
bridge instruments; compensation; computerised instrumentation; electric sensing devices; pressure transducers; semiconductor devices; strain gauges; bridge resistance; digital computing; pressure transducers; real-time process; semiconductor strain gauge; thermal compensation; thermal stability; Aerodynamics; Aerospace electronics; Aerospace engineering; Bridge circuits; Capacitive sensors; Laboratories; Pressure measurement; Temperature sensors; Testing; Transducers;
Conference_Titel :
Instrumentation in Aerospace Simulation Facilities, 1991. ICIASF '91 Record., International Congress on
Conference_Location :
Rockville, MD
DOI :
10.1109/ICIASF.1991.186267