Title :
Wettability and Reliability Evaluation of Sn-9Zn solder on Cu Substrates Using Three Novel Soldering Fluxes
Author :
Xu, Dongxia ; Lei, Yongping ; Zhu, Lei ; Xia, Zhidong ; Guo, Fu ; Shi, Yaowu
Author_Institution :
Beijing Univ. of Technol., Beijing
Abstract :
The wetting behavior of Sn-9Zn solder on Cn substrates with three types of novel soldering fluxes (Fluxl. Flux2 and Flux3 as abbreviation) and the effect of fluxes residues on reliability of PCB were investigated. Two methods, spreading test and wetting balance test were used to estimate the wettability of Sn-9Zn solder on Cu substrates. Flux2 and Flux3 were promising fluxes for Sn-9Zn solder in electronic assembly due to little corrosion of fluxes residues and halide-free in their flux formulations, though Sn-9Zn solder exhibited better wettability with Fluxl in two test methods. Surface insulation resistance (SIR) test estimated performance of electric insulation of the fluxes residues. Samples soldered with Flux2 and Flux3 had higher SIR readings than Fluxl. which indicated higher reliability of Flux2 and Flux3. By means of SEM and EDS. it was found that serve corrosion was caused by the chloride residues of Flux 1 which contained chloride activators.
Keywords :
circuit reliability; copper; printed circuits; soldering; surface resistance; tin; wetting; zinc; Cu; Sn; Zn; electronic assembly; reliability evaluation; soldering fluxes; surface insulation resistance; wettability; Circuit testing; Copper; Environmentally friendly manufacturing techniques; Lead; Materials reliability; Organic compounds; Soldering; Surface resistance; Temperature; Tin;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441438
