• DocumentCode
    2903830
  • Title

    Design of Solder Joint for Self-Alignment in Optical Fiber Attachment Soldering

  • Author

    Zhang, Wei ; Wang, Chunqing ; Tian, Yanhong

  • Author_Institution
    Harbin Inst. of Technol., Harbin
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The self-alignment motion of optical fiber is critical to the low-cost and high-precision direct-coupling technology in optoelectronic packaging. In this research, the self-alignment method by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain software called Surface Evolver and the three-dimensional (3D) geometry of solder joint with different pad shape was analyzed. Then, the self-alignment behavior of solder joint with an initial yaw misalignment was discussed and the theoretical equilibrium positions of five different pad shapes were calculated. Next, experiments were done to examine the theoretical equilibrium positions of these pads. The numerical results show that the theoretical equilibrium positions of ellipse pad are the major axis of ellipse, and it is much more appropriate for self-alignment. And the diamond pad and the combined pad have also self-alignment effects, but the square and the crisscross pad are not appropriate for self-alignment due to more than two equilibrium positions. The experimental results show the solder joint with initial yaw angle can be self-aligned to the theoretical equilibrium position of these five pads and solder joint of ellipse pad demonstrates smaller alignment error than that of diamond and combined pads.
  • Keywords
    electronics packaging; integrated optoelectronics; optical fibre fabrication; public domain software; soldering; surface tension; Surface Evolver; high-precision direct-coupling technology; optical fiber attachment soldering; optoelectronic packaging; public domain software; self-alignment motion; solder joint design; surface tension; three-dimensional geometry; yaw misalignment; Costs; Electronics packaging; Materials science and technology; Mathematical model; Optical design; Optical fiber devices; Optical fibers; Shape; Soldering; Surface tension;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441441
  • Filename
    4441441