DocumentCode
2903842
Title
The investigation of interaction between low-temperature solders and emission body of dispenser cathodes
Author
Dyubua, B. Ch ; Polivnikova, O.V.
Author_Institution
Cathode Dept., Moscow, Russia
fYear
2011
fDate
21-24 Feb. 2011
Firstpage
423
Lastpage
424
Abstract
The principal problem, which arises at construction of multibeam cathode units, is provision of small spread in emission parameters of separate emitters in the unit preserving the mechanical strength and the shape stability of the cathode unit. The problem is reduced to task of effective attachment of emitters to their seats in the holder of the unit.
Keywords
cathodes; field emission; solders; dispenser cathodes; emission body; low-temperature solders; mechanical strength; multibeam cathode units; shape stability; Cathodes; Compounds; Materials; Soldering; Tungsten; emissive parameters; multibeam cathode units; solder;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference (IVEC), 2011 IEEE International
Conference_Location
Bangalore
Print_ISBN
978-1-4244-8662-5
Type
conf
DOI
10.1109/IVEC.2011.5747056
Filename
5747056
Link To Document