Title :
The investigation of interaction between low-temperature solders and emission body of dispenser cathodes
Author :
Dyubua, B. Ch ; Polivnikova, O.V.
Author_Institution :
Cathode Dept., Moscow, Russia
Abstract :
The principal problem, which arises at construction of multibeam cathode units, is provision of small spread in emission parameters of separate emitters in the unit preserving the mechanical strength and the shape stability of the cathode unit. The problem is reduced to task of effective attachment of emitters to their seats in the holder of the unit.
Keywords :
cathodes; field emission; solders; dispenser cathodes; emission body; low-temperature solders; mechanical strength; multibeam cathode units; shape stability; Cathodes; Compounds; Materials; Soldering; Tungsten; emissive parameters; multibeam cathode units; solder;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2011 IEEE International
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-8662-5
DOI :
10.1109/IVEC.2011.5747056
