Aluminum Ribbon Bonding Technology in a New Package of High Power and Thermal Performance

To meet the strong market demand for smaller and thinner device with higher power, lower package resistance and higher thermal capability package for power management field, several technical approaches are being researched by IDM companies worldwide. Based on GEM´s experience and existing technique for discrete package assembly and testing. GEMPAK5060, a flat leaded package, originated from the S0IC8. lias been developed. GEMPAK5060. utilizing the Al ribbon bonding technique, allows smaller dimension and better power performance than S0IC8. This paper presents the advantages of state-of-art ribbon bonding technology on GEMPAK5060 package. Its performance with regard to achieving higher power and lower resistance in power semiconductor package is also discussed.