DocumentCode :
2904014
Title :
Interconnect Open Defect Diagnosis with Physical Information
Author :
Zou, Wei ; Cheng, Wu-Tung ; Reddy, Sudhakar M.
Author_Institution :
Mentor Graphics Corp., Wilsonville, OR
fYear :
2006
fDate :
20-23 Nov. 2006
Firstpage :
203
Lastpage :
209
Abstract :
Circuit behavior in the presence of interconnect open defects is affected by four major factors: the capacitances between the floating node and its neighboring nodes, the capacitances inside down-stream gates, initial trapped charge, and the threshold voltages of down-stream gates. Current interconnect open diagnosis methods either ignore all of these factors or consider a subset of them only. Thus the diagnosis results from current procedures may not be as accurate as possible. In this paper, we present an interconnect open defect diagnosis method taking all these factors into account. Experiments conducted on benchmark circuits demonstrate that the proposed method can achieve a very high diagnosis accuracy and resolution
Keywords :
fault diagnosis; integrated circuit interconnections; integrated circuit testing; benchmark circuits; down-stream gate capacitance; down-stream gates; floating node capacitance; initial trapped charge; interconnect open defect diagnosis; neighboring node capacitance; physical information; threshold voltages; CMOS technology; Capacitance; Circuit faults; Cities and towns; Failure analysis; Graphics; Integrated circuit interconnections; Logic; Threshold voltage; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Symposium, 2006. ATS '06. 15th Asian
Conference_Location :
Fukuoka
ISSN :
1081-7735
Print_ISBN :
0-7695-2628-4
Type :
conf
DOI :
10.1109/ATS.2006.261021
Filename :
4030769
Link To Document :
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