• DocumentCode
    2904070
  • Title

    Elastic Property of Cu3Sn Determined by a First-Principles Calculation on the Basis of its Crystal Substructure

  • Author

    An, R. ; Wang, C.Q. ; Tian, Y.H.

  • Author_Institution
    Harbin Inst. of Technol., Harbin
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    As compared with the significance for controlling reliability of solder joints, research on elastic behavior of Cu3Sn has not been given enough consideration mainly because of the difficulty in preparing acceptable single-phase sample. In this paper, independent elastic constants of single crystal Cu3Sn are determined from first-principles calculations with a pseudopotential plane-wave method to completely characterize its polycrystalline elastic behavior and elastic anisotropy. The ideal elastic, shear and bulk modulus (E=147GPa, G=56GPa and K=132GPa) as well as the Poisson´s ratio (v=0.315) of Cu3Sn were predicted by Voigt-Reuss-Hill method. Cu3Sn exhibited distinct anisotropy in Young´s modulus, as shown by the large difference between maximum and minimum of 44GPa, which may be partially responsible for the discrepancy in the experimental results. The Young´s modulus of Cu3Sn with texture in real solder joints was also explored.
  • Keywords
    Poisson ratio; Young´s modulus; copper alloys; elastic constants; reliability; shear modulus; solders; tin alloys; Cu3Sn; Poisson´s ratio; Voigt-Reuss-Hill method; Young´s modulus; bulk modulus; crystal substructure; elastic anisotropy; elastic constants; elastic modulus; elastic property; polycrystalline elastic behavior; pseudopotential plane-wave method; shear modulus; solder joint reliability; Anisotropic magnetoresistance; Annealing; Copper; Crystallization; Electronics packaging; Intermetallic; Materials science and technology; Mechanical factors; Soldering; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441454
  • Filename
    4441454