DocumentCode
2904200
Title
Design and performance verification of space grade multi-output medium power, electronic power conditioner under thermo-vacuum environment
Author
Singh, Bhoopendrakumar ; Joteppa, Santosh ; Prasad, Satyanarayana ; Chippalkatti, Vinod S. ; Garvalia, R.N. ; Domadia, K.G. ; Parmar, R M ; Dave, R K ; Samudraiah, D R M
Author_Institution
Centum Electron. Ltd., Bangalore, India
fYear
2011
fDate
21-24 Feb. 2011
Firstpage
459
Lastpage
460
Abstract
Space grade subsystems require judicious combination of design, analysis and testing to realize a flight worthy hardware. These subsystems operate in an environment considerably different from that in which they are built and after launch they are inaccessible to routine maintenance and repair. The thermal vacuum test is one of the most critical environmental tests. This paper presents the design considerations for realizing a space grade Electronic Power Conditioner (EPC) from its thermal and vacuum performance perspective. Comparison is made between the results of the thermal analysis and actual test under vacuum conditions. Design margins are also established to achieve the onboard performance of the EPC under vacuum in geo-stationary environment for a product life of 15 years.
Keywords
avionics; power supplies to apparatus; thermal analysis; vacuum microelectronics; environmental test; geo-stationary environment; performance verification; product life; repair; routine maintenance; space grade electronic power conditioner; space grade multioutput medium power; space grade subsystem; thermal analysis; thermal vacuum test; thermo-vacuum environment; vacuum condition; Aerospace electronics; Electronic packaging thermal management; Hardware; Materials; Power supplies; Temperature measurement; Thermal analysis; Electronic Power Conditioner (EPC); space grade power supply; thermal analysis; thermo-vacuum test;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference (IVEC), 2011 IEEE International
Conference_Location
Bangalore
Print_ISBN
978-1-4244-8662-5
Type
conf
DOI
10.1109/IVEC.2011.5747074
Filename
5747074
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