Title :
Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder
Author :
Wang, Huan ; Hu, Anmin ; Li, Chengkang Chang Ming ; Mao, Dali
Author_Institution :
Shanghai Jiao Tong Univ., Shanghai
Abstract :
Concentrations of 0.1. 0.3. and 0.5 wt.% of Cr were added to Sn-3Ag-3Bi alloy to produce Sn-Ag-Bi-Cr alloys. The microstmcture is refined with Cr additions, while significantly improves the oxidation resistance. There is no change in the wettability and liquidus temperature after Cr additions. In addition, the effect of Cr addition on the intermetallic compounds was discussed.
Keywords :
bismuth alloys; chromium alloys; oxidation; silver alloys; solders; tin alloys; Sn-Ag-Bi-Cr; intermetallic compounds; lead-free solders; oxidation resistance; Bismuth; Chromium alloys; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Materials science and technology; Oxidation; Soldering; Surface resistance; Temperature;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441468
