Title :
Green Policy in an International Power Management Manufacturing Services Provider in China
Author :
Fang, Wangsheng ; Yang, Hongbo ; Zhou, Ming ; Tsui, Anthony C.
Author_Institution :
GEM Electron. Co. Ltd., Shanghai
Abstract :
Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.
Keywords :
environmental factors; semiconductor device manufacture; semiconductor device packaging; China; green package manufacturing; green policy; international power management; manufacturing services provider; power management semiconductor suppliers; process improvement; research path; Communication industry; Consumer electronics; Electronic packaging thermal management; Energy management; Environmental management; Green products; Industrial electronics; Manufacturing processes; Semiconductor device manufacture; Thermal management;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441473