Direct Copper Bonded Ceramic Substrates for Use with Power LEDS

Author

Dehmel, Alfred ; Schulz-Harder, Jüirgen ; Roth, Alexander ; Baumeister, Ingo

Author_Institution

Electrovac Curamik, Regensburg

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

6

Abstract

The past years saw a marked increase in power density for packaged LEDs and also an increase in requested lifetimes for the same modules. This leads to the need for substrate materials that show an improved thermal conductivity and reliability over standard FR4 or insulated metal substrates. Direct copper bonded (DCB) substrates offer a significantly lower thermal resistance and have already become the standard carrier for high power, high voltage inverters and solid state relays.

Keywords

bonding processes; ceramics; copper; light emitting diodes; power semiconductor diodes; semiconductor device manufacture; semiconductor device packaging; semiconductor device reliability; thermal conductivity; thermal management (packaging); thermal resistance; Cu; direct copper bonded ceramic substrates; high voltage inverters; packaged LED; power LED; solid state relays; substrate materials; thermal conductivity; thermal reliability; thermal resistance; Bonding; Ceramics; Conducting materials; Copper; Inorganic materials; Light emitting diodes; Materials reliability; Packaging; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441481

Filename

4441481