• DocumentCode
    2904570
  • Title

    Effects of moisture on radiation-induced degradation in CMOS SOI transistors

  • Author

    Shaneyfelt, Marty R. ; Schwank, James R. ; Dodd, Paul E. ; Hill, Tom A. ; Dalton, Scott M. ; Swanson, Scot E.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    2009
  • fDate
    14-18 Sept. 2009
  • Firstpage
    20
  • Lastpage
    23
  • Abstract
    The effects of moisture on radiation-induced charge buildup in the oxides of a 0.35 μm SOI technology are explored. Data show no observable effects of moisture-related aging on radiation hardness. These results are in contrast to those of previous work performed on bulk MOS technologies fabricated in the 1980s. The cause of these differences do not appear to be due to differences in final chip passivation layers. Instead, other processing variables (including the use of different implant materials and thicker overlayers) may account for these differences. In any case, the SOI technology results indicate that not all advanced technologies exposed to moisture are necessarily susceptible to significant long-term radiation-induced aging effects.
  • Keywords
    CMOS integrated circuits; moisture; passivation; radiation hardening (electronics); silicon-on-insulator; transistors; CMOS SOI transistor; MOS radiation effect; SOI technology; bulk MOS technology; chip passivation layer; implant material; long-term radiation-induced aging effect; moisture; radiation hardness; radiation-induced charge buildup; radiation-induced degradation; size 0.35 mum; Aging; Logic gates; Moisture; Passivation; Radiation effects; Silicon; Transistors; MOS radiation effects; aging effects; hydrogen exposure; ionizing radiation; moisture exposure; silicon-on-insulator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation and Its Effects on Components and Systems (RADECS), 2009 European Conference on
  • Conference_Location
    Bruges
  • ISSN
    0379-6566
  • Print_ISBN
    978-1-4577-0492-5
  • Electronic_ISBN
    0379-6566
  • Type

    conf

  • DOI
    10.1109/RADECS.2009.5994546
  • Filename
    5994546