DocumentCode :
2904585
Title :
Design of MEMS Filter for Wimax Systems
Author :
Wei, De-fang ; Li, Ying-liang ; Zhao, Ji-de
Author_Institution :
Ludong Univ., Yantai
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
3
Abstract :
Novel MEMS (micro-electric-mechanical-system) SAW (surface acoustic wave) is designed in tins paper, and it is manufactured by CMOS, it is easy to integrate other components for SOC (system on chip). The filter is realized by CPW (coplanar waveguide) cavity and BAR (bulk acoustic resonator), and then the equal circuit model is analyzed, the parameters of circuit model is extracted by ADS (advanced design systems) software. The performance of filter is analyzed by HFSS software, and it center frequency is 2.2 GHz, 3 dB band is 200 MHz. The test model is analyzed by equal CMOS circuit, and the performance of models achieved by network Analyzer; center frequency of 2.28 GHz, 3 dB band of 100 MHz, band stop more than 20 dB, and scale of 3.5times2.0 mm2. The filter is satisfied with the requirement of Wimax communications systems, and it has micro scale, easily integrating. If these design physical parameters are changed, the different performances of filters are obtained, and the design has theory and application value.
Keywords :
CMOS integrated circuits; WiMax; bulk acoustic wave devices; coplanar waveguides; micromechanical devices; surface acoustic wave filters; surface acoustic wave resonators; system-on-chip; ADS software; BAR; CMOS circuit; CPW cavity; HFSS software; MEMS filter design; SAW; SOC; WiMax communication system; advanced design system; bulk acoustic resonator; coplanar waveguide; equal circuit model analysis; frequency 100 MHz; frequency 2.2 GHz; frequency 200 MHz; microelectric-mechanical-system; network analyzer; surface acoustic wave; system-on-chip; Acoustic waves; Circuits; Coplanar waveguides; Frequency; Micromechanical devices; Performance analysis; Resonator filters; Semiconductor device modeling; Surface acoustic waves; WiMAX; CPW; Filter; MEMS; Wimax;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4441482
Filename :
4441482
Link To Document :
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