Title :
Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor
Author :
Shen, Guangping ; Wu, Jian ; Zhang, Hua ; Qin, Ming ; Huang, Qing An
Author_Institution :
Southeast Univ., Nanjing
Abstract :
The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8%.
Keywords :
flow sensors; integrated circuit packaging; printed circuits; resins; thermal insulation; 2-D thermal flow sensor; DCA packaging; PCB board; direct chip attachment; printed circuit board; thermal insulated resin; Bonding; Ceramics; Detectors; Fabrication; Packaging; Resins; Temperature sensors; Thermal conductivity; Thermal sensors; Wire;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441487
