DocumentCode :
2904773
Title :
High temperature ultrasonic transducers for monitoring of micro-molding
Author :
Kobayashi, M. ; Jen, C.-K. ; Corbeil, C. ; Ono, Y. ; Hébert, H. ; Derdouri, A.
Author_Institution :
Dept. of ECE, McGill Univ., Montreal, Que., Canada
Volume :
2
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
1119
Abstract :
Thick film (90μm) piezoelectric ceramic ultrasonic transducers (UTs) have been successfully deposited on a barrel and a mold insert of a micro-molding machine by a sol-gel spray technique. The ball-milled bismuth titanate fine powders are dispersed into PZT solution to achieve the gel. The gel is then sprayed onto the substrate at room temperature. The films with desired thickness have been obtained through multilayer coating approach. Piezoelectricity is achieved using a corona discharge poling method. These UTs can operate at more than 500°C. The center frequency of ultrasound generated is 13 MHz and 6 dB bandwidth is 13 MHz. In the pulse/echo mode the ultrasonic signals have a signal to noise ratio of more than 30dB. The ability of these UTs to monitor the polymer properties in real-time at the barrel and the mold insert of the micro-molding machine during processing is demonstrated.
Keywords :
micromachining; moulding; piezoceramics; piezoelectric transducers; sol-gel processing; thick films; ultrasonic transducers; 13 MHz; PZT; PZT solution; PbZrO3TiO3; ball milling; bismuth titanate; corona discharge poling; echo mode; fine powders; micromolding monitoring; multilayer coating; noise ratio; piezoelectric ceramic devices; piezoelectricity; polymer properties; pulse mode; room temperature; sol-gel spray; substrate; thick film; ultrasonic signals; ultrasonic transducers; Bismuth; Ceramics; Monitoring; Powders; Spraying; Substrates; Temperature; Thick films; Titanium compounds; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293097
Filename :
1293097
Link To Document :
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