An Edge-View-Photodetector for Simplification of Optical Packaging

Author

Li, Zhihua ; Shen, Huajun ; Yang, Chengyue ; Li, Baoxia ; Wan, Lixi

Author_Institution

Chinese Acad. of Sci., Beijing

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

3

Abstract

A new 850 nm edge-view-photodetector (EVPD) was designed, fabricated and measured. The EVPD is designed to simplify optical packagings in an optical interconnects system by eliminating the using of turning mirrors and microlenses. The PIN active area of the photodetector is fabricated on a sloping sidewall of mesa structures. The resulting photodetector becomes edge viewing while the electrical pads remain horizontal. The EVPD fabrication process and initial measurement results are presented in this letter. The main processing steps include deep anisotropic chemical etching, material growth on slope and lithography on 3-D micro structure.

Keywords

etching; lithography; microlenses; micromirrors; packaging; photodetectors; 3D microstructure lithography; anisotropic chemical etching; edge-view-photodetector; electrical pads; material growth; microlenses; optical packaging; turning mirrors; Anisotropic magnetoresistance; Lenses; Microoptics; Mirrors; Optical design; Optical device fabrication; Optical interconnections; Packaging; Photodetectors; Turning; 3-D microstructure; EVPD; epitaxy; optical interconnect; optical packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441491

Filename

4441491