DocumentCode :
2904914
Title :
Distribution of the dynamic strain and stress components within a layered film of a SAW resonator on LiTaO3
Author :
Kubat, F. ; Ruile, W. ; Hesjedal, T. ; Stotz, J. ; Rosler, U. ; Reindl, L.
Author_Institution :
Inst. of Electr. Inf. Technol., Clausthal Univ. of Technol., Germany
Volume :
2
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
1149
Abstract :
Based on recent reports about the acoustical power distribution in SAW resonators we present an analytical method of the distribution of the dynamic strain and stress components in SAW resonators on LiTaO3. This enables us to calculate the absolute strain and stress values for each point within the layer of a resonator for any driving condition and frequency. The SAW resonator is described by our P-matrix based model, which gives us the longitudinal distribution of the total acoustic power and the kinetic and potential power. For the calculation of the relative strain and stress values we used the partial wave method. Using the correlation between the total acoustic power and the energy density distribution normal to the substrate surface we can calculate the absolute strain and stress values for a given input power. For the direct experimental verification of our calculations we measured the SAW induced displacements as a function of input power.
Keywords :
acoustic variables measurement; lithium compounds; strain measurement; stress measurement; surface acoustic wave resonators; LiTaO3; P-matrix based model; SAW resonator; SAW-devices; acoustical power distribution; dynamic strain distribution; dynamic stress distribution; energy density distribution; kinetic power; layered film; longitudinal distribution; partial wave method; potential power; strain components; stress components; Acoustic measurements; Capacitive sensors; Displacement measurement; Frequency; Kinetic theory; Power distribution; Power measurement; Stress; Substrates; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293104
Filename :
1293104
Link To Document :
بازگشت